IC Tray

• Dimension Specifications: Adheres to the industry-standard JEDEC international standard outline dimensions (322.6 mm × 135.9 mm), ensuring seamless compatibility with automated production lines, loaders, and pick-and-place equipment across major packaging and testing facilities.
• Material and Temperature Resistance: Manufactured using mainstream semiconductor-grade MPPE / MPPO (Modified Polyphenylene Ether) engineering plastics. With a heat resistance reaching up to Max. 130°C, it is well-suited for general IC and electronic component transportation, high-temperature baking, and temporary storage management.
• Customized Internal Layout: The internal pocket count, pitch, and pocket depth can be fully customized and tooled according to the IC packaging specifications provided by customers (such as BGA, QFN, QFP, etc.), satisfying precise positioning and protection needs for diverse chip dimensions.

Customization Services

• Develop dedicated molds based on customer-provided component dimensions and drawings, free from off-the-shelf limitations.
• Materials can be selectively chosen based on process temperature needs; PEI is selected for high-temperature tolerance, while corresponding engineering plastics are utilized for general applications to balance cost and specifications.
• Customized planning for grid configurations, positioning structures, and stacking methods tailored to customer needs.
• Provides sample trial molding and specification verification workflows to ensure full compliance with customer process requirements prior to shipment.