Chip Tray / IC Tray Overview

During the production, testing, and transportation of semiconductors and electronic components, specialized carrier trays are essential for protection and positioning. This prevents components from being damaged by collisions, static electricity, or deformation during handling, high-temperature baking, and automated pick-and-place processes. Depending on the IC package type, process temperature requirements, and anti-static levels, these carrier trays require corresponding material and layout designs rather than a single universal specification.

CFY Technology possesses comprehensive mold design and precision injection molding capabilities. We can tailor-make dedicated Chip Tray / IC Tray molds and products based on the component size, packaging type, and process temperature requirements provided by our customers, breaking free from off-the-shelf limitations to solve custom or special sizing challenges that standard products cannot meet.

For any custom requirements regarding Chip Tray or IC Tray, feel free to contact us. Provide your component drawings and specification requirements, and we will evaluate the most suitable material and mold design solution for you.