During the production, testing, and transportation of semiconductors and electronic components, specialized carrier trays are essential for protection and positioning. This prevents components from being damaged by collisions, static electricity, or deformation during handling, high-temperature baking, and automated pick-and-place processes. Depending on the IC package type, process temperature requirements, and anti-static levels, these carrier trays require corresponding material and layout designs rather than a single universal specification.
CFY Technology possesses comprehensive mold design and precision injection molding capabilities. We can tailor-make dedicated Chip Tray / IC Tray molds and products based on the component size, packaging type, and process temperature requirements provided by our customers, breaking free from off-the-shelf limitations to solve custom or special sizing challenges that standard products cannot meet.
1. Chip Tray
- Material Features: Crafted with PEI (Polyetherimide) material, offering exceptional high-temperature resistance and dimensional stability. It is ideally suited for high-temperature processes such as bake-out and reflow where strict thermal stability is required.
- Design Advantages: The tray body can be engineered with precision positioning holes and guide post structures based on customer requirements, facilitating seamless pick-and-place and stacking alignment by automated equipment to ensure component positions remain precise and unshifted during processing.
2. IC Tray
- Dimension Specifications: Adheres to the industry-standard JEDEC international standard outline dimensions (322.6mm X 135.9 mm), ensuring seamless compatibility with automated production lines, loaders, and pick-and-place equipment across major packaging and testing facilities.
- Material and Temperature Resistance: Manufactured using mainstream semiconductor-grade MPPE / MPPO (Modified Polyphenylene Ether) engineering plastics. With a heat resistance reaching up to Max. 130°C, it is well-suited for general IC and electronic component transportation, high-temperature baking, and temporary storage management.
- Customized Internal Layout: The internal pocket count, pitch, and pocket depth can be fully customized and tooled according to the IC packaging specifications provided by customers (such as BGA, QFN, QFP, etc.), satisfying precise positioning and protection needs for diverse chip dimensions.
Customization Services
- Develop dedicated molds based on customer-provided component dimensions and drawings, free from off-the-shelf limitations.
- Materials can be selectively chosen based on process temperature needs; PEI is selected for high-temperature tolerance, while corresponding engineering plastics are utilized for general applications to balance cost and specifications.
- Customized planning for grid configurations, positioning structures, and stacking methods tailored to customer needs.
- Provides sample trial molding and specification verification workflows to ensure full compliance with customer process requirements prior to shipment.
