Chip Tray

• Material Features: Crafted with PEI (Polyetherimide) material, offering exceptional high-temperature resistance and dimensional stability. It is ideally suited for high-temperature processes such as bake-out and reflow where strict thermal stability is required.
• Design Advantages: The tray body can be engineered with precision positioning holes and guide post structures based on customer requirements, facilitating seamless pick-and-place and stacking alignment by automated equipment to ensure component positions remain precise and unshifted during processing.

Customization Services

• Develop dedicated molds based on customer-provided component dimensions and drawings, free from off-the-shelf limitations.
• Materials can be selectively chosen based on process temperature needs; PEI is selected for high-temperature tolerance, while corresponding engineering plastics are utilized for general applications to balance cost and specifications.
• Customized planning for grid configurations, positioning structures, and stacking methods tailored to customer needs.
• Provides sample trial molding and specification verification workflows to ensure full compliance with customer process requirements prior to shipment.